6n135,6n136 2007-10-01 1 toshiba photocoupler gaa ? as ired & photo ic 6n135, 6n136 digital logic isolation. line receiver. power supply control switching power supply transistor inverter the toshiba 6n135 and 6n136 consists of a high emitting diode and a one chip photo diode ? transistor. each unit is 8 ? lead dip package. ? isolation voltage: 2500v rms (min.) ? high speed: t phl , t plh = 0.5 s (typ.) (r l = 1.9k ? ) ? ttl compatible ? if base pin is open, output signal will be noisy by environmental condition. for this base, tlp550 is suitable ? ul recognized: ul1577, file no. e67349 unit in mm toshiba 11 ? 10c4 weight: 0.54 g (typ.) pin configurations 8 v cc 6 v o 7 v b 5 gnd i cc i b i o i f i f v f 2 3 1 : n.c. 2 : anode 3 : cathode 4 : n.c. 5 : emitter 6 : collector 7 : base, anode 8 : cathode 8 7 6 5 1 2 3 4 8
6n135,6n136 2007-10-01 2 absolute maximum ratings (ta = 25c) characteristic symbol rating unit forward current (note 1) i f 25 ma pulse forward current (note 2) i fp 50 ma total pulse forward current (note 3) i fpt 1 a reverse voltage v r 5 v led diode power dissipation (note 4) p d 45 mw output current i o 8 ma peak output current i op 16 ma emitter ? base reverse voltage (pin 5 ?7) v eb 5 v supply voltage v cc ?0.5~15 v output voltage v o ?0.5~15 v base current (pin 7) i b 5 ma detector output power dissipation (note 5) p o 100 mw operating temperature range t opr ?55~100 c storage temperature range t stg ?55~125 c lead solder temperature (10s) (note 6) t sol 260 c isolation voltage (note 7) bv s 2500 v rms note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc. ) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. oper ating temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (note 1) derate 0.8ma above 70c. (note 2) 50% duty cycle, 1ms pulse width. derate 1.6ma / c above 70c. (note 3) pulse width 1 s, 300pps. (note 4) derate 0.9mw / c above 70c. (note 5) derate 2mw / c above 70c. (note 6) soldering portion of lead: up to 2mm from the body of the device. (note 7) r.h. 60%, ac / 1min.
6n135,6n136 2007-10-01 3 electrical characteristics over recommended temperature (ta = 0c~70c unless otherwise noted) characteristic symbol test c ondition min. (**)typ. max. unit 6n135 7 18 D % 6n136 ctr i f = 16ma, v o = 0.4v v cc = 4.5v, ta = 25c (note 8) 19 24 D % 6n135 5 13 D % current transfer ratio 6n136 ctr i f = 16ma, v o = 0.5v v cc = 4.5v (note 1) 15 21 D % 6n135 i f = 16ma, i o = 1.1ma v cc = 4.5v D 0.1 0.4 v logic low output voltage 6n136 v ol i f = 16ma, i o = 2.4ma v cc = 4.5v D 0.1 0.4 v i f = 0ma, v o = v cc = 5.5v ta = 25c D 3 500 na i oh i f = 0ma, v o = v cc = 15v ta = 25c D 0.1 1 a logic high output current i oh i f = 0 ma, v o = v cc = 15v D D 50 a logic low supply current i ccl i f = 16ma, v o = open v cc = 15v D 40 D a i cch i f = 0ma, v o = open v cc = 15v, ta = 25c D 0.01 1 a logic high supply current i cch i f = 0ma, v o = open v cc = 15v D D 2 a input forward voltage v f i f = 16ma, ta = 25c D 1.65 1.7 v temperature coefficient of forward voltage v f / ta i f = 16ma D ?1.9 D mv / c input reverse breakdown voltage bv r i r = 10 a, ta = 25c 5 D D v input capacitance c in f = 1mhz, v f = 0 D 60 D pf resistance (input ?output) r i ? o v i ? o = 500v (note 9) r.h. 60% D 10 12 D ? capacitance (input ?output) c i ? o f = 1mhz (note 9) D 0.6 D pf transistor dc current gain h fe v o = 5v, i o = 3ma D 80 D D (**) all typicals at ta = 25c
6n135,6n136 2007-10-01 4 switching specifications (unless otherwise specified. ta = 25c, v cc = 5v, i f = 16ma) characteristic symbol test circuit test condition min. typ. max. unit 6n135 r l = 4.1k ? D 0.2 1.5 s propagation delay time to logic low at output 6n136 t phl 1 r l = 1.9k ? D 0.2 0.8 s 6n135 r l = 4.1k ? D 1.0 1.5 s propagation delay time to logic high at output 6n136 t plh 1 r l = 1.9k ? D 0.5 0.8 s 6n135 i f = 0ma v cm = 10v p? p r l = 4.1k ? D 1000 D v / s common mode transient immunity at logic high level output (note 10) 6n136 cm h 2 i f = 0ma v cm = 10v p? p r l = 1.9k ? D 1000 D v / s 6n135 v cm = 10v p? p r l = 4.1k ? i f = 16ma D ?1000 D v / s common mode transient immunity at logic low level output (note 10) 6n136 cm l 2 v cm = 10v p? p r l = 1.9k ? i f = 16ma D ?1000 D v / s bandwidth (note 11) bw D r l = 100 ? D 2 D mhz (note 8) dc current transfer ratio is defined as the ratio of output collector current, i o , to the forward led input current, i f , times 100%. (note 9) device considered a two ? terminal device: pins 1, 2, 3, and 4 shorted together and pins 5, 6, 7 and 8 shorted together. (note 10) common mode transient immunity in logic high level is the maximum tolerable (positive) dv cm / dt on the leading edge of the common mode pulse, v cm , to assure that the output will remain in a logic high state (i.e., v o > 2.0v). common mode transient immunity in logic lo w level is the maximum tolerable (negative) dv cm / dt on the trailing edge of the common mode pulse signal, v cm , to assure that the output will remain in a logic low state (i.e., v o < 0.8v). (note 11) the frequency at which t he ac output voltage is 3db belo w the low frequency asymptote.
6n135,6n136 2007-10-01 5 test circuit 1. (*) c l is approximately 15 p f which includes probe and stray wiring capacitance. test circuit 2. v ol i f 0 v o 1.5v 1.5v 5v t p lh t p hl 7 6 5 1 2 3 4 8 5v v o c l (*) r l i f 100 pulse gen. z o = 50 t f = 5ns 10% duty cycle i f monitor v ol v cm 0v v o switch at b : i f = 16ma t r , t f = 8ns 5v v o 10v 10% t f 90% 90% 10% t r switch at a : i f = 0ma 7 6 5 1 2 3 4 8 5v v o r l a b v ff i f p u l s e g en. v cm
6n135,6n136 2007-10-01 6 i oh (1) ? ta ambient temperature ta (c) high level output current i oh (1) (na) 100 1 3 50 30 10 5 0 40 80 120 160 0.6 300 ambient temperature ta (c) v f / ta ? i f forward current i f (ma) forward voltage temperature coefficient v f / ta (mv / c ) -2.6 0.1 -2.4 -2.2 -2.0 -1.8 -1.6 0.3 0.5 1 3 5 10 -1.4 30 i o / i f i f forward current i f (ma) current transfer ratio i o / i f (%) 50 30 10 5 3 1 0.5 0.3 100 50 30 10 5 3 1 v cc = 5v v o = 0.4v 25c ta = - 25c 100c forward current i f (ma) i f ? v f forward voltage v f (v) 100 50 1.0 30 10 5 1.2 1.4 1.6 1.8 2.0 3 1 0.5 0.3 0.1 0.05 0.03 0.01 ta = 25 c forward current i f (ma) i o - i f output current i o (ma) 10 0.01 3 0.5 0.3 0.03 100 300 50 30 10 5 3 1 0.1 0.05 0.1 1 5 v cc = 5v v o = 0.4v ta = 25 c 0.3 0.5 i o / i f ? ta notmalized i o / i f 0 0 20 40 60 80 - 20 100 0.2 - 40 0.4 0.6 0.8 1.0 1.2 normalized to : i f = 16ma v cc = 4.5v v o = 0.4v
6n135,6n136 2007-10-01 7 i o ? v o output voltage v o (v) output current i o (ma) 10 8 6 7 2 0 v cc = 5v ta = 25 c 5 4 3 2 1 0 4 6 10ma 15ma 20ma 25ma 30ma i f = 5ma v o ? i f forward current i f (ma) output voltage v o (v ) 5 0 4 3 2 1 4 8 12 16 20 0 24 v o i f v cc =5v ta = 2 5 r l r l = 2k 3.9 10 t phl, t plh ? r l load resistance r l (k ) propagation delay time t phl, t plh ( s) 3 1 0.3 1 5 10 50 100 0.1 5 30 3 0.5 i f = 16ma v cc = 5v ta = 25 c t plh t phl
6n135,6n136 2007-10-01 8 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability handbook? and (b) t he instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? 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